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PREPARED
BY: Lvl
DATE: -WI DATE: / ,t/97 ELECTRONIC COMPONENTS GROUP SHARP CORPOFNI'ION
SPECNo. ::: REPRESENTATIVE
DC396029 J&16/99 10 Pages DIVISION:
-7'- . tieda APPROVED BY: Jk 3-F "LAS
SPlkIFICATION
DEVICE SPECIFICATION FOR
Opto-Electronic Devices Division
Light Emitting Diode
MODEL No.
GL5ZS302BOS
1. These specification sheets include materials protected under the copyright of Sharp Corporation ("Sharp"). Please do not reproduce or cause anyone to reproduce them without Sharp's consent. 2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (Precautions) (1) This products is designed for use in the following application areas: * OA equipment * Audio visual equipment * Home appliance * Measuring equipment * Telecommunication equipment (Terminal) * Tooling machines * Computers r If the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3). please be sure to observe the precautions given in those respective paragraphs. (2) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; * Transportation control and safety equipment (aircraft, train, automobile etc.) * Gas leakage sensor breakers * Rescue and security equipment * Traffic signals * Other safety equipment [ (3) Please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; * Space equipment * Telecommunication equipment (for trunk lines) * Medical equipment i * Nuclear power control equipment (4) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. Please contact and consult with a Sharp sales representative for any questions about this product. &,i //c$ DATE: PRESENTED BY: 9-i , ./kzzzq2 M.Katoh, Department General Manager of Engineering Dept.m Opto-Electronic Devices Division Electronic Components Group SHARP CORPORATION
1
I
1
/99)'
CUSTOMER'S
APPROVAL
DATE: BY:
x996029 MODEL No.
Junl16l99 PAGE
GL5ZS302BOS
l/10
GL5ZS302BOS
Snecifkation
1. Application This specificationappliesto the light emitting diode deviceModel No. GL5ZS302BOS. [AlGaInF (dicing or scribebake type) Sunset-orange LED device]
2. Outline dimensions pin connections. . . . . ..*...................a and
Refer to the attachedsheetPage2.
. 3. Ratingsandcharacteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage3-4. 3- 1. Absolute maximumratings 3-2. Electra-opticalcharacteristics 3-3. DeratingCurve 3-4. CharacteristicsDiagram
4. Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage5. 4-l. Test itemsandtest conditions 4-2. Measurement itemsandFailurejudgement criteria .. 5. Incoming inspection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage6. 5-1. Applied standard 5-2. Samplingmethodand level 5-3. Test items,judgementcriteria and classificaof defect 5-4. Test itemsthe surfaceis be applied for flat type, judgementcriteria andclassificaof defect
. 6. Supplement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Refer to the attachedsheetPage7-8. 6-1. Packing 6-2. Luminousintensity rank 6-3. Dominantwavelengthrank 6-4. Environment
7. Precautions usq . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage9+ 10. for 7-l. Leadforming method 7-2. Notice of installation 7-3. SolderingConditions .7-4. For cleaning
DC3996029
MODEL No.
Jun/16/9!3
PAGE
GL5ZS302BOS
2110
2. Outline dimensions and pin comectiolls
Colorless transparency -
94.
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15
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pin coIlnections 0. Anode 0. cathode
Vote) Umpecified tol. to be +0.2mm qote) Cold klled steelleadsare platedwith but ti ie tie-bar cut portionshave no plating do not solderthis part of the product. Unit mm Material Lead : (Fe) Cold rolled steel Package: Epoxy resin Fish Lead : Sn platedor wave soldering Drawing No. 51106010
L---J
2. 4
DG9@329 MODEL. No.
Julll16/99
PAGE
I
GL5ZS302BOS
I
3110
I
3. Ratingsandcharacteristics
I
(Note 1) Duty ratio=l/lOJUse width=O.lms (Note 2) At the positionof 1.6~ from the bottom resinpackage 3-2. Electra-opticalcharacteristics I Parameter i Svmbol 1 (Ta=25"C) Conditions
7ia.
KTYP. IMAx.l
Unity I
Spectrumradiationbandwidth A1 15 run Reversecurrent VR=W 100 /.JA 1, Terminal capacitance ct V=OV,f=MHz 60 pF IViewing Angle 1 2eii2 1 lF=2omA 1 30 1 1 deg. 1 (Note 3) Refer to the suplement item 6. regardingthe standard rank classification. of
I
3-3. Derating Curve
Peak
Forward
Current
Derating
Curve
Forward
Current
Derating
Curve
60 50 80 60 40 30 20 10 0 -25 0 Ambient 25 50 75J100 Ta("CI 125 -25 0 Ambient 25 50 Temperature 75a5 100 Ta ("C) 125
Temperature
DG996029 MODEL No.
Jun/16/99
PAGE
4110
GL5ZS302BOS
Peak
Forward
Current
vs.
Duty Ratio (Ta=25%)
10 l/100 l/10 Duty Raito 1 DR 10
3-4. Characteristics
Forward
Diagram(typ) (Note 1)
Current vs.Forward Voltage (Ta=25"C) Relative Luminous Intensity vs. Ambient Temperature ( I F=2OmA) 1000
100
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1
10
$ .c* s c
ii
.-ea v 5 -I .-z %I 100
liiiiiiii
iiiiiiil
j 1 j j / / / //
Iiii
0. 1 1 1.2 1.4 Forward
Relative Ominous
E 1.6 1.8 Vo I tage
Intensity vs.
10 -60-40-20 Ambient 0 20 40 Temprature 60 80 100 120 Ta ("C).
2
2.2 VF (VI
Froward
2.42.6
Voltaca
1000 5 .Ln
2 :
(Ta=ZS'C)
100
10 2
O-
.r 5
E
1
3 ," .z 0. 1
0. 1 Forward
1 Current
10 IFGnAI
100
(Note 1) Above characteristic data are typical data and not a guarantteed data.
DG996029 MODEL No. GL5ZS302BOS
1 .Junl16/9!3 ) PAGE 5110
4. Reliability The reliability of products shall be satisfied with items listed below. 4-l. Test itemsandtest conditions I Test items I Solderability
soldering
Confidencelevel: 90% Test conditions
23025C. 5s IPrior disnosition : Div in rosin flux
I
temoerature ~ Mechanical shock Variable frequency vibration Terminal strength (Tension) Terminal strength (Bending)
260"5z,
5s n=ll, C=O n=ll, C=O n=ll, C=O + 0" n=ll. 60 n=22, C=O n=22, C=O n=22, C=O n=22, Go n=22, C=O I 20 20 20 20 10 10 10 10 10 I
15 OOOm/s2. 0.5ms. 3times /S&Y&Z direction 200m/s2, to 2 Oooto lOOBz/sweep 4min. 100 for ,4tirnes/iX&Y &Z direction Weight:lON, Ss/each terminal WeightH,O" --f 90" +OO+-90" /each terminal
I
I
Temperature cycling ~-4O~(3Omin)~+lOO"c(30min),3Ocycles
Hi@'temP* Qh md
humidity storage
Ta=+&)~, gO%m, t=l@)oh
Iigh temperature storageTa=lOO"c, t=lOOOh ow temperature storageTa=-40%. t=lOOOh I Operationlie Ta=`Z"C. IrMAX, t=lOOOh*3
4-2. Measurement itemsandFailurejudgementcriteria * 1 Measurement Forward voltage Reversecurrent Luminousintensity Symbol
VF
Failurejudgementcriteria *2 VF > u.s.,a. x 1.2 IR > U.S.L. x 2.0 Iv > The first stagevalue X 2.0 or The first stage value X 0.5 > IV
IR
IV
s Solderability : Sol&r shallbe adhereat the areaof 95% or moreof dippedportion. z Terminal strength: Package not destroyed,and terminal is not slack. is * 1: Measuringcondition is in accordance with specification. *2: U.S.L. is shownby Upper SpecificationLimit. *3: IF M.AX.is shownby forward current of absolute maximumratings.
DG996029
MODEL No.
Jud16/99
PAGE 6ilO
GL5ZS302BOS
5. Incoming inspection 5-l. Applied standard IS0 2859-l : 5-2. Samplingmethodand level : A single samplingplannormalinspection level II : AQL Major defect : 0.065% Minor defect : 0.4%
c1 J-J. Tan, IGJL :*a-, ILGulJ,
,"u~~rnGur
:..A,.P....s..,
&*a;a C.IWIAQ
sna au&a
r.l.x.;ficn bALwaA4I-Y
nf "I
f4`af.w.t -I"-*
1 No. e 1 2 3 4 5
6
Test items Disconnection Positionof Cutting off rim Reverseterminal Outline dimensions Characteristics Cut off the rim Foreign substance Scratch Void Uneven densityof materialfor scattering Unbalanced center Burr Insertion positionof terminal
judgementcriteria Not emit light Different from dimension Different from dimension Not satisfy outline specification Over the limit value of specification Vr, Is, and Iv at Exceed -0.2mm White point : Exceed o 0.3mm (on top view) Black point : Exceed 4 0.3mm (on top view) String form: Exceed 3.Omm(ontopview) Exceed 9 0.3mmor O.lmm x l.Omm(on top view) Exceed 9 0.3mm (on top view) Extremely unevendensity Exceed M.25mm from package center Exceed +0.2mmagainstprovided dimension Insertion positionof terminal
classiiicaof defec
Major defect
7 8 9 10 11 12 13
Minor defect
5-4. Test itemsthe surfaceis be appliedfor flat type, judgumentcriteria and classificaof defect No. 14 15 Test items Chappedthe surface Hollow the surface I judgementcriteria The surfacechappedis striking for seethe lamp top The surfacehollow is striking for seethe lamp top classiticaof defec Minor defect
DG996029 MODEL No.
Jun/16/99
PAGE I 7110
I
GL5ZS302BOS
6. Supplement 6-l. Packing 6-l-l. Inner package Put 25Opcs the same luminous intensity rank products into pack and put following label by pack. Product weight : 028g (One ProducfTyp.) (Indication label sample) SIiIPbtENT TABLE PART No. ~~52~302~0s + Model number *clcl cloclclcl 250 - Quantily of pm4iucts QUANTITY
OT No. KA99B19 +LOtllUUlber* 0 O-FiG 0
O-0 tSHARP'
MADE INJAPAN
Luminousintensity rank dominantwavelengthrank
+ Production country
@ @ Q) @ @
Productionplant code(to be indicatedalphabetically) Supportcode Year of prcduction(thelast two figures of the year) (to be indicatedalphabeticallywith Januarycorresponding A) to Month of production Date of production(Ol-31)
6-l-2. Outer package Put 8 packs (the same luminousintensity rank) into outerpackage. (approximately670gper oneouter package) 6-l-3. Outer package line dimension out Width: 14Omm,Depth: 225mm, Hight: 9Omm )us 6-2.Luminc intensity rank (Note 1) Luminousintensity Rank L 552 1075 M 795 1548 N 1144 2229 0 1 1648 (3210) (Ta=25"c) Condition 1~2OmA I I
unit mcd 1
I(Note 1)Tolerance:fl5%
In regardto luminousintensity, the following rankingshallbe carriedout. However the quantity of eachrank shallnot be pre scriid. In case the distributionof the luminousintensity shift to high, at that of point new upperrank is prescribed lower rank is delete. and 6-3.Dominantwavelengthrank (Note 2) Dominantwavelength Rank I 0 602.0 1 598.5 a(Ta=25"c ) Condition
(Note 2) The condition of measurementThe measurement the light emissionfrom the front sideof lamp. : of This rank value is the settingvalue of when that classifies the rank and be not a guarantee it value. Also I shallnot askthe delivery ratio of eachrank.
DG996029 MODEL No. GL5ZS302BOS I
Jun/16/99 PAGE 8110
64. Environment 641. Ozonosphere destructive chemicals. (1) The device doesn't contain following substance. (2) The &vice doesn't have a production line whose process requires following substance. Restricted part: CFCs,halones,CCh.Trichloroethane(Methych) 642. Brornic non-burning materials The device doesn't contain bromic non-burning materiaW'BBOs,PBBs)
DG996029
MODEL No.
Juni16/99
PAGE
GL5ZS302BOS
g/10
7. Precautions for use
7 - 1. Lead forming method Avoid forming a lead pin with the lead pin base as a fulcrum:be sure to hold a lead pin firmly when forming. Lead pins should be formed before soldering. 7 - 2. Notice of installation 7-Z-l installation on a PWB Whenmounting an LED lamp on a PWBdo not apply physical stress to the lead pins. The lead pin pitch should match the PWBpin-hole pitch:absolutely avoid widening or narrowing the lead pins. Whenpositioning an LED lamp,basically employ an LEDwith tie-bar cut or use a spacer. 7-Z-Z Whenan LED1 is mounted directly on a P W B If the bottom face of an LED lamp is mounted directly on single-sided PWBthe base of the lead pins may be subjected to physical stress due to PWB warp,cutting or clinching of lead pins. Prior to use, be sure to check that no disconnection inside of the resin or damage to resin etc., is found. Whenan LED lamp is mounted on a double-sided PWB,theheat during soldering affects the resin;therefore.keep the LED lamp more that 1.60~1afloat above the PWB. 7-Z-3 Installation using a holder During an LEDlamp positioning,when a holder is used,a holder should be designed not to subject lead pins to any undue stress. (Note)Pay attention to the thermal expansion coefficient of the material used for the holder.Since the holder e.xpandsand contracts due to preheat and soldering heat, mechanical stress may be applied to the lead pins, resulting in disconnection. 7-Z-4 Installation to the case Do not fix part C with adhesives when fixed to the case as shown in Figure.A hole of the case should be designed not to subject the ins to any undue stress.
l l
Gooc
DG996029
MODEL No.
I
Jun/16/99
lo/lo
( PAGE
GL5ZS302BOS
7 - 3. S oldering Conditions Solder the lead pins under the following conditions Conditions Type of S oldering I 1. Manual soldering 295"C*S"C, within 3 seconds 2. Wave soldering 260C+S"C, within 5 seconds P reheating 70C to 8O"c, within 30 seconds 3. Auto soldering S oldering 245C25C. within 5 seconds (Note) Avoid dipping resin into soldering bath Avoid applying stress to lead pins while they are heated.For example , when the LED lamp is moved with the heat applied to the lead pins during manual soldering or solder repair, disconnection may occur.
7 - 4. For cleaning ( 1) (2) Solvent cleaning : Solvent temperature 45C or less Immersion for 3 min or less Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs by cleaning bath size.ultrasonic power output, cleaning time, PYBsize or device mounting condition etc. Please test it in actual using condition and confirm that doesn't occur any defect before starting the ultrasonic cleaning.
<3 > Applicable solvent : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol In case when the other solvent is used,there are cases that the packaging resin is eroded Please use the other solvent after thorough confirmation is performed in actual using condition.

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